{"id":23884,"date":"2026-02-08T13:08:19","date_gmt":"2026-02-08T12:08:19","guid":{"rendered":"https:\/\/www.lites.tf.fau.de\/?p=23884"},"modified":"2026-04-15T15:18:27","modified_gmt":"2026-04-15T13:18:27","slug":"hw-rfic-packaging-design-and-electromagnetic-modeling","status":"publish","type":"post","link":"https:\/\/www.lites.tf.fau.de\/en\/2026\/02\/08\/hw-rfic-packaging-design-and-electromagnetic-modeling\/","title":{"rendered":"MA\/BA\/FP: RFIC Packaging Design and Electromagnetic Modeling"},"content":{"rendered":"<p style=\"margin: 0in;font-family: Calibri;font-size: 11.0pt\">(suitable for HW\/FP\/MA; scope and depth will be adapted to ECTS and prior knowledge)<\/p>\n<h2 data-start=\"400\" data-end=\"418\"><strong data-start=\"403\" data-end=\"418\">Description<\/strong><\/h2>\n<p data-start=\"420\" data-end=\"654\">We will build an <strong data-start=\"437\" data-end=\"485\">end-to-end RFIC and RF packaging design flow<\/strong><br data-start=\"485\" data-end=\"488\" \/><em data-start=\"488\" data-end=\"542\">(schematic \u2192 layout \u2192 EM \u2192 circuit\/EM co-simulation)<\/em> using both <strong data-start=\"554\" data-end=\"575\">open-source tools<\/strong> and <strong data-start=\"580\" data-end=\"607\">commercial environments<\/strong>, and systematically <strong data-start=\"628\" data-end=\"653\">correlate the results<\/strong>.<\/p>\n<p data-start=\"656\" data-end=\"830\">The focus of this work is <strong data-start=\"682\" data-end=\"731\">RF packaging and chip\u2013package\u2013PCB transitions<\/strong>, including <strong data-start=\"743\" data-end=\"829\">bondwires, bond pads, package interconnects, and RF transitions to PCB or antennas<\/strong>.<\/p>\n<p data-start=\"832\" data-end=\"850\">The work includes:<\/p>\n<ul data-start=\"851\" data-end=\"1090\">\n<li data-start=\"851\" data-end=\"924\">\n<p data-start=\"853\" data-end=\"924\">RFIC and package-aware circuit design (schematic, layout, verification)<\/p>\n<\/li>\n<li data-start=\"925\" data-end=\"974\">\n<p data-start=\"927\" data-end=\"974\">Full-wave EM simulation of packaging structures<\/p>\n<\/li>\n<li data-start=\"975\" data-end=\"1018\">\n<p data-start=\"977\" data-end=\"1018\">Circuit\u2013EM co-simulation and de-embedding<\/p>\n<\/li>\n<li data-start=\"1019\" data-end=\"1090\">\n<p data-start=\"1021\" data-end=\"1090\">Benchmarking open-source tools against <strong data-start=\"1060\" data-end=\"1090\">Cadence \/ ADS \/ HFSS \/ CST<\/strong><\/p>\n<\/li>\n<\/ul>\n<h3>Research Question<\/h3>\n<ul>\n<li data-start=\"1279\" data-end=\"1433\">\n<p data-start=\"1281\" data-end=\"1366\">How large are the discrepancies between <strong data-start=\"1321\" data-end=\"1336\">open-source<\/strong> and <strong data-start=\"1341\" data-end=\"1355\">commercial<\/strong> tools for:<\/p>\n<ul data-start=\"1369\" data-end=\"1433\">\n<li data-start=\"1369\" data-end=\"1383\">\n<p data-start=\"1371\" data-end=\"1383\">S-parameters<\/p>\n<\/li>\n<li data-start=\"1386\" data-end=\"1407\">\n<p data-start=\"1388\" data-end=\"1407\">Gain, NF, P1dB, IP3<\/p>\n<\/li>\n<li data-start=\"1410\" data-end=\"1433\">\n<p data-start=\"1412\" data-end=\"1433\">Phase and group delay<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<li data-start=\"1434\" data-end=\"1645\">\n<p data-start=\"1436\" data-end=\"1479\">Which effects dominate these discrepancies:<\/p>\n<ul data-start=\"1482\" data-end=\"1645\">\n<li data-start=\"1482\" data-end=\"1535\">\n<p data-start=\"1484\" data-end=\"1535\">Packaging parasitics (bondwires, pads, transitions)<\/p>\n<\/li>\n<li data-start=\"1538\" data-end=\"1573\">\n<p data-start=\"1540\" data-end=\"1573\">Port definitions and de-embedding<\/p>\n<\/li>\n<li data-start=\"1576\" data-end=\"1611\">\n<p data-start=\"1578\" data-end=\"1611\">EM meshing and numerical settings<\/p>\n<\/li>\n<li data-start=\"1614\" data-end=\"1645\">\n<p data-start=\"1616\" data-end=\"1645\">Model and layout abstractions<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<li data-start=\"1646\" data-end=\"1739\">\n<p data-start=\"1648\" data-end=\"1739\">How accurately can <strong data-start=\"1667\" data-end=\"1699\">chip\u2013package\u2013PCB transitions<\/strong> be modeled with open-source EM solvers?<\/p>\n<\/li>\n<li data-start=\"1740\" data-end=\"1939\">\n<p data-start=\"1742\" data-end=\"1815\">How can the <strong data-start=\"1754\" data-end=\"1787\">open-source RF packaging flow<\/strong> be simplified and improved:<\/p>\n<ul data-start=\"1818\" data-end=\"1939\">\n<li data-start=\"1818\" data-end=\"1859\">\n<p data-start=\"1820\" data-end=\"1859\">Netlisting and co-simulation interfaces<\/p>\n<\/li>\n<li data-start=\"1862\" data-end=\"1904\">\n<p data-start=\"1864\" data-end=\"1904\">EM setup, boundary conditions, and ports<\/p>\n<\/li>\n<li data-start=\"1907\" data-end=\"1939\">\n<p data-start=\"1909\" data-end=\"1939\">Automation and reproducibility<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<h3 data-start=\"1946\" data-end=\"1967\">Research Goals<\/h3>\n<ul data-start=\"1969\" data-end=\"2595\">\n<li data-start=\"2359\" data-end=\"2448\">\n<p data-start=\"2361\" data-end=\"2401\">Develop <strong data-start=\"2369\" data-end=\"2400\">parametric packaging models<\/strong>:<\/p>\n<ul data-start=\"2404\" data-end=\"2448\">\n<li data-start=\"2404\" data-end=\"2448\">\n<p data-start=\"2406\" data-end=\"2448\">Bondwires, pad stacks, package transitions<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<li data-start=\"2449\" data-end=\"2595\">\n<p data-start=\"2451\" data-end=\"2466\"><strong data-start=\"2451\" data-end=\"2465\">Automation<\/strong>:<\/p>\n<ul data-start=\"2469\" data-end=\"2595\">\n<li data-start=\"2469\" data-end=\"2541\">\n<p data-start=\"2471\" data-end=\"2541\">Python pipelines for parameter sweeps, EM simulations, post-processing and packaging simulation<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<p data-start=\"2471\" data-end=\"2541\"><strong style=\"color: #04316a;font-size: 24px;letter-spacing: 0.32px\">Skills<\/strong><\/p>\n<ul>\n<li>Overall grade better than 2.0<\/li>\n<li>\n<p style=\"margin: 0in;font-family: Calibri;font-size: 11.0pt\"><span style=\"font-weight: bold\">Programmierung\/EDA<\/span><\/p>\n<ul style=\"direction: ltr;margin-top: 0in;margin-bottom: 0in\" type=\"disc\">\n<li style=\"margin-top: 0;margin-bottom: 0;vertical-align: middle\">Solid Python skills<\/li>\n<li style=\"margin-top: 0;margin-bottom: 0;vertical-align: middle\"><span style=\"font-family: Calibri;font-size: 11.0pt\">Interest in new tools.<\/span><\/li>\n<li style=\"margin-top: 0;margin-bottom: 0;vertical-align: middle\"><span style=\"font-family: Calibri;font-size: 11.0pt\">Basics of Cadence\/ADS\/HFSS\/CST-Basics are a plus.<\/span><\/li>\n<li style=\"margin-top: 0;margin-bottom: 0;vertical-align: middle\"><span style=\"font-family: Calibri;font-size: 11.0pt\">Linux fundamentals, reproducible workflows.<\/span><\/li>\n<\/ul>\n<p style=\"margin: 0in;font-family: Calibri;font-size: 11.0pt\"><span style=\"font-weight: bold\">RF-Design<\/span><\/p>\n<ul>\n<li data-start=\"2751\" data-end=\"2849\">\n<p data-start=\"2753\" data-end=\"2849\">Fundamentals of S-parameters, matching, stability; optional: noise, large-signal, phase noise.<\/p>\n<\/li>\n<li data-start=\"2751\" data-end=\"2849\">\n<p data-start=\"2753\" data-end=\"2849\">Understanding of common RF topologies (amplifiers, mixers, oscillators, passive networks).<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<hr \/>\n<p style=\"text-align: right\"><a class=\"rrze-elements standard-btn primary-btn\" href=\"mailto:gianluca.simone@fau.de?subject=Anfrage%20f\u00fcr:%20MA:%20Open%20Source%20RFIC%20Design\"><span>Anfrage senden<\/span><\/a><\/p>\n\n\n\n\n\n\n<h3 class=\"wp-block-heading\">Contact<\/h3>\n\n\n<div class=\"faudir\">\r\n         <div class=\"format-compact\">\r\n        \r\n                <section class=\"format-compact-container\" aria-labelledby=\"section-title-53707-1563\" itemscope itemtype=\"https:\/\/schema.org\/Person\">\r\n                                            <div class=\"profile-image-section\"> \r\n                            <figure itemprop=\"image\" itemscope itemtype=\"http:\/\/schema.org\/ImageObject\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.lites.tf.fau.de\/files\/2025\/02\/Image.jpg\" alt=\"GS\" srcset=\"https:\/\/www.lites.tf.fau.de\/files\/2025\/02\/Image.jpg 906w, https:\/\/www.lites.tf.fau.de\/files\/2025\/02\/Image-265x300.jpg 265w, https:\/\/www.lites.tf.fau.de\/files\/2025\/02\/Image-768x868.jpg 768w, https:\/\/www.lites.tf.fau.de\/files\/2025\/02\/Image-53x60.jpg 53w, https:\/\/www.lites.tf.fau.de\/files\/2025\/02\/Image-212x240.jpg 212w, https:\/\/www.lites.tf.fau.de\/files\/2025\/02\/Image-283x320.jpg 283w, https:\/\/www.lites.tf.fau.de\/files\/2025\/02\/Image-416x470.jpg 416w\" itemprop=\"contentUrl\"><meta itemprop=\"width\" content=\"906\"><meta itemprop=\"height\" content=\"1024\"><meta itemprop=\"license\" content=\"https:\/\/www.lites.tf.fau.de\/imprint\"><\/figure>                        <\/div>\r\n                                            <header class=\"profile-header\">\r\n                       <h1 id=\"section-title-53707-1563\"><a itemprop=\"url\" href=\"https:\/\/www.lites.tf.fau.de\/en\/faudir\/gianluca-simone\/\"><span class=\"displayname\" itemprop=\"name\"><span class=\"namepart\"><span itemprop=\"givenName\">Gianluca<\/span> <span itemprop=\"familyName\">Simone<\/span><\/span><\/span><\/a><\/h1><p class=\"organisation_name\"><span class=\"organization\" itemprop=\"name\">Chair of Smart Electronics and Systems<\/span><\/p><p class=\"jobtitle\">Research associates<\/p>                \r\n                     <\/header>\r\n                     <div class=\"profile-details\">   \r\n                        <div class=\"profile-address\"><h2 class=\"address-title\">Address<\/h2><div class=\"workplace-address\" data-wpautop=\"off\"><address class=\"texticon\" itemprop=\"address\" itemscope itemtype=\"https:\/\/schema.org\/PostalAddress\"><span class=\"street\" itemprop=\"streetAddress\">Cauerstra\u00dfe 7-9<\/span> <span class=\"zipcity\"><span class=\"postalCode\" itemprop=\"postalCode\">91058<\/span> <span class=\"addressLocality\" itemprop=\"addressLocality\">Erlangen<\/span><\/span><\/address><\/div><\/div><div class=\"profile-contact\"><h2 class=\"contact-title\">Contact<\/h2><ul class=\"icon list-icons\"><li class=\"email listcontent\"><span class=\"value\"><span class=\"screen-reader-text\">Email: <\/span><a itemprop=\"email\" href=\"mailto:gianluca.simone@fau.de\">gianluca.simone@fau.de<\/a><\/span><\/li><\/ul><\/div><div class=\"profile-socialmedia\"><h2 class=\"screen-reader-text\">Social Media and Websites<\/h2><div class=\"icon-list icon\"><ul class=\"list-icons\"><li><a href=\"https:\/\/linkedin.com\/in\/gianluca-simone-412x\/\" itemprop=\"sameAs\" aria-label=\"Linkedin-Profile of Gianluca Simone\"><span class=\"link-text\" aria-hidden=\"true\">linkedin.com\/in\/gianluca-simone-412x\/<\/span><\/a><\/li><\/ul><\/div><\/div>                 <\/div>\r\n                <\/section>    \r\n                <\/div>\r\n\r\n<\/div>\n\n\n\n","protected":false},"excerpt":{"rendered":"<p>(suitable for HW\/FP\/MA; scope and depth will be adapted to ECTS and prior knowledge) Description We will build an end-to-end RFIC and RF packaging design flow(schematic \u2192 layout \u2192 EM \u2192 circuit\/EM co-simulation) using both open-source tools and commercial environments, and systematically correlate the results. The focus of this work is RF packaging and chip\u2013package\u2013PCB [&hellip;]<\/p>\n","protected":false},"author":5309,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_rrze_cache":"enabled","_rrze_multilang_single_locale":"en_US","_rrze_multilang_single_source":"https:\/\/www.lites.tf.fau.de\/?p=23881","footnotes":""},"categories":[582,581,583],"tags":[],"workflow_usergroup":[456],"class_list":["post-23884","post","type-post","status-publish","format-standard","hentry","category-ba_eng","category-fp_eng","category-ma_eng","en-US"],"_links":{"self":[{"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/posts\/23884","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/users\/5309"}],"replies":[{"embeddable":true,"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/comments?post=23884"}],"version-history":[{"count":3,"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/posts\/23884\/revisions"}],"predecessor-version":[{"id":24193,"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/posts\/23884\/revisions\/24193"}],"wp:attachment":[{"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/media?parent=23884"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/categories?post=23884"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/tags?post=23884"},{"taxonomy":"workflow_usergroup","embeddable":true,"href":"https:\/\/www.lites.tf.fau.de\/wp-json\/wp\/v2\/workflow_usergroup?post=23884"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}